Structures for radiofrequency applications and related methods

ABSTRACT

Substrates for microelectronic radiofrequency devices may include a substrate comprising a semiconductor material. Trenches may be located in an upper surface of the substrate, at least some of the trenches including a filler material located within the respective trench. A resistivity of the filler material may be 10 kOhms·cm or greater. A piezoelectric material may be located on or above the upper surface of the substrate. Methods of making substrates for microelectronic radiofrequency devices may involve forming trenches in an upper surface of a substrate including a semiconductor material. A filler material may be placed in at least some of the trenches, and a piezoelectric material may be placed on or above the upper surface of the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/109,978, filed Dec. 2, 2020, which is a continuation of U.S. patentapplication Ser. No. 16/308,602, filed Dec. 10, 2018, now U.S. Pat. No.10,943,815, issued Mar. 9, 2021, which is a national phase entry under35 U.S.C. § 371 of International Patent Application PCT/FR2017/051418,filed Jun. 6, 2017, designating the United States of America andpublished as International Patent Publication WO 2017/212160 A1 on Dec.14, 2017, which claims the benefit under Article 8 of the PatentCooperation Treaty to French Patent Application Serial No. 1655266,filed Jun. 8, 2016, the disclosure of each of which is herebyincorporated herein in its entirety by this reference.

TECHNICAL FIELD

The present disclosure relates to the field of integrated radiofrequency devices.

BACKGROUND

For most applications involving the transmission or reception of radiofrequency signals (10 MHz to 100 GHz), the devices require a substratethat increasingly fulfills demanding specifications, particularly drivenby the changing standards of mobile telephony (2G, 3G, LTE, LTEAdvanced, LTE Advanced PRO, 5G . . . ). The properties of substratematerials must specifically ensure:

-   -   Low insertion losses (low signal attenuation) and good linearity        (low signal distortion causing harmonics), typically by        presenting an effective resistivity over a wide range of        frequencies, greater than 1000 ohms·cm;    -   Stability of these temperature performances, particularly within        the range of use of devices (−40° C. to 150° C.);    -   Sufficient heat dissipation capacity, typically due to a thermal        conductivity greater than 20 W/m·K;    -   A weak capacitive coupling between the active layer and the        support substrate, typically thanks to a dielectric permittivity        equal to or lower than that of silicon (ϵ_(silicon)=11).

Moreover, in order to meet high volume requirements, the substrate mustbe compatible with the semiconductor industry and particularly with CMOSsilicon manufacturing lines. Of course, it must also have a competitivecost to be adopted by consumer applications, particularly in the fieldof telecommunications (telephony and cellular network, Wi-Ficonnectivity, BLUETOOTH®). Space and military applications areparticularly sensitive to performance and temperature resistance.

Radio frequency (RF) devices such as antenna switches and adaptors,power amplifiers, low noise amplifiers or even passive components (R, L,C) can be developed on different types of substrates.

For example, silicon-on-sapphire substrates known as SOS (silicon onsapphire) are known which allow the components produced usingmicroelectronic technologies in the surface layer of silicon to benefitfrom the insulating properties of sapphire substrate materials,irrespective of temperature, its conductivity that is greater than 20W/m·K and its permittivity that is less than 11. For example, theantenna switches and power amplifiers manufactured on this type ofsubstrate exhibit very good factors of merit but are mainly used forniche applications because of the too high overall cost of the solution.

Also known are high-resistivity silicon substrates comprising a supportsubstrate, a trapping layer (a few hundred nanometers to a few micronsthick) laid out on the support substrate, a dielectric layer laid out onthe trapping layer, and a semiconductor layer laid out on the dielectriclayer. The support substrate usually has a resistivity greater than 1kohm·cm. The trapping layer may comprise undoped polycrystallinesilicon. The combination of a high resistivity silicon support substrateand a trapping layer, based on the state of the art, makes it possibleto eliminate the parasitic conducting layer usually present under theoxide layer buried in the SOI HR (Silicon on insulator with highresistivity silicon support substrate). The skilled person will find areview of the performance of RF devices manufactured on a highresistivity semiconductor substrate known in the Background of theInvention in “Silicon-on-insulator (SOI) Technology, Manufacture andApplications,” points 10.7 and 10.8, Oleg Kononchuk and Bich-Yen Nguyen,Woodhead Publishing.

Nevertheless, a poly-silicon trapping layer has the disadvantage ofundergoing partial recrystallization during high temperature heattreatment steps, which contributes to reducing the density of traps inthe layer. The degradation of the RF device performance related to thisdecrease in the density of traps may be prohibitive for certainapplications. Moreover, these substrates struggle to ensure thestability of the RF performances over the entire range of operatingtemperatures, particularly above 100° C. Their resistivity fallsconsidering the generation of thermal carriers in the support substrateand the coupling device/substrate becomes a major contributor to signalattenuation and distortion. Performance degradation has also beenobserved when the temperature drops below 0° C. Finally, permittivitywill remain very close to that of silicon (about 11).

Other support substrates, such as aluminum nitride or silicon carbide,would meet the RF properties specifications but are not compatible withthe standard semiconductor industry. Their use as a support substratefor transferring the final layer of devices is conceivable.Nevertheless, the cost of these specific materials combined with that ofthe circuit transfer technologies is still too high for a mass adoptionof these solutions.

BRIEF SUMMARY

A purpose of the present disclosure is thus to propose a substratesuitable for radiofrequency applications, remedying all or part of thedisadvantages of the prior art.

The disclosure, in particular, relates to a substrate formicroelectronic radiofrequency devices comprising:

-   -   A support substrate made of a first semiconductor material with        a resistivity greater than 500 ohms·cm,    -   A plurality of trenches in the support substrate, filled with a        second material, and defining on a first side of the support        substrate, a plurality of first zones of the first material and        at least one second zone of the second material.

The substrate is remarkable in that:

-   -   The second material has a resistivity greater than 10 kohms·cm;    -   The first zones have a maximum dimension of less than 10 microns        and are isolated from one another by the second zone.

The role of the upper part of the substrate according to the disclosurecomprising the trenches filled with the second material is to block themovement of the movable charges which can be generated in the vicinityof the first side of the support substrate so that the latter maintainsa high and stable resistivity level.

The restriction on the maximum dimension of the first zones and theinsulation of these first zones from one another by at least one secondzone made of a highly resistive material, make it possible to block themovement of potential moving charges in the first zone semiconductormaterial constituting the support substrate, in the upper part. In thisupper part, the charges have to travel a greater distance to pass fromone first zone to another first neighboring zone by bypassing thetrenches filled with the second material. The effective resistivity ofthe substrate is thus increased.

This makes it possible to specifically eliminate the harmful effects ofa parasitic conduction in a substrate on which RF devices are made.

According to advantageous features of the disclosure, taken alone or incombination:

-   -   the surface density of the first zones and of the second zone        confers on an upper part of the substrate extending from the        first side of the support substrate to a depth of the trenches        an average thermal conductivity greater than 20 W/m·K, an        average dielectric permittivity less than the permittivity of        the first material and a resistivity higher than the resistivity        of the first material;    -   the second zone forms a mesh on the first side of the support        substrate;    -   the trench depth is between 1 micron and 100 microns;    -   the first material constituting the support substrate is        silicon;    -   the second material filling the trenches is selected from the        group consisting of a silicon oxide, a silicon nitride, a        silicon oxynitride, an aluminum nitride, an amorphous or        polycrystalline silicon, a carbon-rich silicon, a polymer or        even a gas;    -   the plurality of trenches is partially filled with the second        material and partially with a third material of a nature or a        composition different from the second material;    -   the third material is selected from the group consisting of a        silicon oxide, a silicon nitride, a silicon oxynitride, an        aluminum nitride, an amorphous or polycrystalline silicon, a        carbon-rich silicon, a polymer or even a gas;    -   the second or the third material has the properties of trapping        movable electrical charges that can be generated in the first        material;    -   the substrate comprises a dielectric layer laid out on the first        side of the support substrate;    -   the substrate comprises an additional layer between the        dielectric layer and the first side of the support substrate,        composed of the third material;    -   the dielectric layer is made up of a material chosen from a        silicon oxide, a silicon nitride, a silicon oxynitride, or an        aluminum nitride;    -   the dielectric layer is composed of the second material;    -   the substrate comprises a useful layer laid out on the first        side of the support substrate;    -   the dielectric layer is sandwiched between the useful layer and        the first side of the support substrate; and    -   the useful layer is composed of a material chosen from        semiconducting, insulating or conductive materials or        piezoelectric materials.

The disclosure also relates to a structure of microelectronicradiofrequency devices comprising:

-   -   a substrate such as above;    -   a layer of microelectronic devices laid out on the substrate.

According to beneficial features of the disclosure, taken alone or incombination, the microelectronic device is an antenna switch or adaptoror a power amplifier or a low noise amplifier or a passive component ora radiofrequency MEMS component or a radiofrequency filter or anothercircuit operating at high frequencies.

The disclosure further relates to a substrate for microelectronicradiofrequency devices comprising:

-   -   providing a support substrate made of a first semiconductor        material with a resistivity greater than 500 ohms·cm,    -   Mask etching of a plurality of trenches extending from the first        side of the support substrate to a determined depth; and    -   Filling the plurality of trenches with a second material to form        first areas of first material on the first side and at least one        second zone of the second material;

The method is remarkable in that the first zones, whose maximumdimension is less than 10 microns, are insulated from one another by thesecond zone whose second material has a resistivity greater than 10kohms·cm.

Finally, the disclosure relates to a substrate for microelectronicradiofrequency devices comprising:

-   -   Providing a support substrate made of a first semiconductor        material with a resistivity greater than 500 ohms·cm;    -   The local coating, according to a mask, of a plurality of        pillars formed from the first material and of a given height, on        the support substrate; an upper surface of the pillars defining        a first side of the substrate and the pillars being insulated        from each other by a plurality of trenches extending from the        first side of the substrate to a depth defined by the determined        height of the pillars;    -   Filling the plurality of trenches with a second material to form        first areas of first material on the first side and at least one        second zone of the second material.

The method is remarkable in that the first zones, whose maximumdimension is less than 10 microns, are insulated from one another by thesecond zone whose second material has a resistivity greater than 10kohms·cm.

BRIEF DESCRIPTION OF THE DRAWINGS

Other characteristics and advantages of the disclosure will emerge fromthe detailed description that follows while referring to theaccompanying drawings in which:

FIG. 1, Panels (a) through (d), show steps of the method ofmanufacturing a substrate according to the disclosure;

FIGS. 2 and 3 show two variants of substrates according to thedisclosure, in plan view and in cross-section;

FIG. 4, Panels (a) and (b), show other variants of substrates accordingto the disclosure, in cross-sectional view;

FIG. 5, Panels (a) and (b), FIG. 6, Panels (a) through (d), and FIG. 9all show substrates according to the disclosure;

FIGS. 7 and 8 show structures of microelectronic radiofrequency devicesaccording to the disclosure; and

FIG. 10 shows a graph representing the effective resistivity of thesubstrate, depending on the operating frequency of microelectronicradiofrequency devices, in structures according to the disclosure.

DETAILED DESCRIPTION

In the descriptive part, the same references in the figures may be usedfor elements of the same type. The figures are schematic representationswhich, for the sake of clarity, are not to scale. In particular, thethicknesses of the layers along the Z axis are not to scale with respectto the lateral dimensions along the X and Y axes, and the relativethicknesses of the layers between them are not necessarily respected inthe figures.

The disclosure relates to a method for producing a substrate suitablefor microelectronic radiofrequency devices, shown in FIG. 1, Panels (a)through (c). The method includes providing a support substrate 10 with afirst semiconductor material 10′ whose resistivity is greater than 500ohms·cm (FIG. 1, Panel (a)). Advantageously, the resistivity of thefirst material will even be chosen to be greater than 1,000 ohms·cm, oreven greater than 3,000 ohms·cm. As illustration, the firstsemiconductor material 10′ may be monocrystalline silicon.

According to the disclosure, the method also includes a phase of etchingthe first side 1 of the support substrate 10, according to a mask, witha plurality of trenches 2 extending from the first side 1 of the supportsubstrate 10 to a determined depth. This etching phase may be precededby a photolithography phase conventionally implemented to define thepatterns to be etched according to the mask and to protect the patternswhich are not to be etched by a masking layer. The etching may becarried out by known techniques of chemical etching, wet or dry. Themasking layer deposited on the first side 1 of the support substrate 10can then be removed, thus obtaining support substrate 10 comprising thetrenches 2, illustrated in FIG. 1, Panel (b).

According to a variant, the trenches 2 may be produced by the localcoating, according to a mask, of a plurality of pillars made up of thefirst material and of a given height on the support substrate 10. Aftercoating, the upper surface of the pillars defines a first side ofsupport substrate 10 and the pillars are insulated from each other by aplurality of trenches extending from the first side to a depth definedby the height of the pillars. Such local coating may, for example, becarried out by selective epitaxy: in this case, the areas to be free ofcoating are covered by a masking layer (in particular silicon oxide ornitride). The epitaxy then takes place locally, on the unmasked areas.After epitaxy, the masking layer present at the bottom of the trenchescan be retained or removed by wet or dry etching.

The manufacturing process further comprises a phase of filling theplurality of trenches 2 with a second material 20. The second material20 will be chosen for its electrical properties: it will in particularhave a resistivity greater than 10 kohms·cm. The second material 20 maybe chosen from electrical insulators, such as silicon oxide, siliconnitride, a silicon oxynitride or aluminum nitride. It may alternativelybe chosen from highly resistive semiconductors such as amorphous,polycrystalline, intrinsic silicon or with chosen compositions, forexample, to stabilize the temperature resistivity (in particular if itis carbon-doped or carbon-rich silicon). Finally, the second material 20may also be chosen from insulating polymers.

As illustration, the phase of filling the trenches 2 can be carried outby chemical, vapor or liquid coating or by heat treatment (for example,by thermal oxidation in the case of filling with silicon oxide).Advantageously, the second material 20 can withstand high heattreatments (notably up to 1000° C. or even 1200° C.) required for thesubsequent fabrication of certain RF devices. In some cases, the secondmaterial 20 will only have to undergo medium or low temperaturetreatments (less than 500° C., or even 350° C.) during the subsequentsteps of manufacturing the devices on substrate 100: this will allowother options for the second material 20, such as polymers, for example,deposited by “sol-gel”-type techniques (spin-coating).

The substrate 100 obtained at this stage of the manufacturing process isillustrated in FIG. 1, Panel (c).

According to a variant illustrated in FIG. 1, Panel (d), the trenches 2may be partially filled by the second material 20 and partially by athird material 23, of different nature and/or composition from thesecond material 20. The third material 23 may be chosen from thematerials stated as being able to constitute the second material 20.Advantageously, the third material 23 will first be deposited on theinternal walls of the trenches 2; the second material 20 then beingdeposited on the third material 23 to fill the trenches 2. As an exampleand without being considered as limiting, a first polycrystallinesilicon coat may be made on the internal walls of the trenches 2; asecond silicon nitride coating can then be made on the polycrystallinesilicon to fill the trenches 2. In this example, the third material 23is made of polycrystalline silicon and the second material 20 is made ofsilicon nitride.

According to another variant, the trenches 2 can be kept in the state ofcavities, that is to say, without filling with any solid material. Thesecond material 20 is in this case made up of a gas or a gaseousmixture, for example, air or other gases, which can be introduced laterduring the manufacturing process according to the disclosure.

According to this variant, a third material 23 may also be deposited onthe internal walls of the trenches 2, the major part of the trench 2being otherwise filled only with a gas or a gaseous mixture.

FIG. 2, Panel (a), illustrates a substrate 100 in plan view, that is tosay, according to the first side 1. Note that the cross-sectional viewof the same substrate 100, along a sectional plan C illustrated in FIG.2, Panel (a), is presented in FIG. 2, Panel (b).

The trenches 2 filled with the second material 20 to form the firstzones 11 of the first semiconductor material 10′ on the first side 1 andat least one second zone 21 of the second material 20. The substrate 100is remarkable in that the first zones 11 have a maximum dimension ofless than 10 microns. According to other advantageous embodiments, themaximum dimension of the first zones 11 will even be less than 8microns, 5 microns or even 2 microns.

The substrate 100 is also remarkable in that the first zones 11 areisolated from each other by the second zone 21 made of the secondmaterial 20, that is to say they are not in contact with each other.Advantageously, they are electrically insulated from each other, thesecond material 20 having a resistivity greater than 10 kohms·cm.Advantageously, the second material 20 or the third material 23 whenused has properties of trapping movable electrical charges that can begenerated in the first semiconductor material 10′.

According to the examples shown in FIG. 2, Panel (a), and FIG. 3, Panel(a), the at least one second zone 21 forms a mesh on the first side 1 ofthe support substrate 10 which separates each of the first zones 11.Depending on the shape of this mesh and the dimensions of the zones 11,21, the surface density of the first zones 11 may be different.Advantageously, the surface density of the first zones 11 will be chosenso as to confer on an upper part 200 of substrate 100, extending fromthe first side 1 of the support substrate 10 to the depth of thetrenches 2, a mean thermal conductivity greater than 20 W/m·K, anaverage dielectric permittivity lower than the permittivity of the firstsemiconductor material 10′ and an effective resistivity greater than theresistivity of the first semiconductor material 10′ or at least greaterthan 1000 ohms·cm.

To illustrate, the first zones 11 may cover between 20 and 70% of thesurface of the first side 1 of the support substrate 10, the second zone21 covering the additional surface.

The trenches 2 have a depth of between 1 micron and 100 microns. For amicroelectronic device (which will be laid out laterally above the upperpart 200 of substrate 100) of lateral dimension a, it can be consideredthat the electric field will penetrate to a depth of about a/3 insubstrate 100. Thus, for an RF antenna switching-type device with atypical lateral dimension of 100 microns, the depth of the trenches 2must be about 30-40 microns, so that the electric field sees only theupper part 200 of substrate 100. The electrical features (effectiveresistivity, permittivity) of the upper part 200 will then condition theperformance of the microelectronic radiofrequency devices laid outabove.

The known techniques of etching make it possible to produce trencheswhose form factor (ratio of lateral dimension to depth) is usuallybetween 1/5 and 1/30. For example, the shape factor of the trenches 2according to the disclosure will typically be between 1/5 and 1/30: fora maximum lateral dimension of 10 microns, the depth of the trenches 2may be between 50 and 100 microns; for a maximum lateral dimension of 1micron, the depth may be between 5 microns and 30 microns.

FIG. 4, Panels (a) and (b), shows an alternative embodiment of substrate100 according to the disclosure. In the upper part 200 of substrate 100,the parts made of the first semiconductor material 10′ can be segmentedin the direction of the depth (i.e., along the Z axis in the figures).For this purpose, at least one segmentation layer 25 of the secondmaterial 20 may be deposited over the entire surface of the first side 1of the support substrate 10 after filling the trenches 2. Thissegmentation layer 25 may be, in one of the second materials 20 referredto above, identical to or different from that used to fill the trenches2.

Subsequent steps of local coating of the first semiconductor material10′ opposite the first zones 11 and the second material 20 opposite thesecond zones 21 will then be carried out. These steps may be repeated asmany times as necessary to achieve several segmentations in thethickness of the upper part 200.

Alternatively, the segmentation of the parts constituted by the firstsemiconductor material 10′ in the upper part 200 may be performed by ionimplantation in substrate 100. To illustrate, the species chosen fromamong oxygen, nitrogen, hydrogen, helium, etc., can be introduced at agiven depth in order to constitute the segmentation layer 25 segmentingin depth the first semiconductor material 10′ parts of the upper part200.

The method for manufacturing the substrate for microelectronicradiofrequency devices according to the disclosure may further comprisea formative stage of a dielectric layer 30 on the first side 1 of thesupport substrate 10 (FIG. 5, Panel (a)). To illustrate, its thicknessmay vary between a few nanometers and 3 μm. Advantageously, thedielectric layer 30 is made from a material chosen from among siliconoxide, silicon nitride, a silicon oxynitride or aluminum nitride. It maybe deposited by various known chemical deposition techniques. Thedielectric layer 30 may optionally be of the same nature as the secondmaterial 20.

According to a variant, illustrated in FIG. 5, Panel (b), a layer of thesecond material is present beneath the dielectric layer 30. In fact,during the trench 2 filling phase of the method according to thedisclosure, a layer of the second material 20 may be deposited in thetrenches 2 and on the first side 1 of the support substrate 10. Aplanarization phase of this layer (for example, a mechanical-chemicalpolishing) can then be carried out to reduce the surface topology,leaving a residual layer 22 in the second material 20 on the first side1 of the support substrate 10.

According to another variant (not shown), the residual layer 22 mayconstitute all or part of the dielectric layer 30.

The manufacturing process may also include a formative stage of anadditional layer 24 on the first side 1 of the support substrate 10prior to the formation of the dielectric layer 30 (FIG. 9).Advantageously, this additional layer 24 is composed of the thirdmaterial 23, the latter having properties of trapping mobile electricalcharges (free carriers) capable of being generated in the firstsemiconductor material 10′.

The substrate manufacturing method for microelectronic radiofrequencydevices according to the disclosure may also include a formative stageof a useful layer 40, laid out on a substrate 100 or 101 according tothe disclosure.

To illustrate, the useful layer 40 is transferred by one of the thinfilm transfer methods well known to those skilled in the art, including:

-   -   The SMART CUT® process, based on the implantation of light        hydrogen and/or helium ions in a donor substrate and a bonding,        for example, by molecular bonding of this donor substrate to        substrate 100 or 101; a detachment phase then makes it possible        to separate a thin surface layer from the donor substrate (the        useful layer), at the embrittlement level defined by the depth        of implantation of the ions. Finishing steps, which may include        heat treatments at high temperature, finally provide the        required crystalline and surface quality to the useful layer 40.        This process is particularly suitable for the manufacture of        very thin useful layers, with a thickness of between a few        nanometers and about 1.5 μm, for example, for silicon layers.    -   The SMART CUT® process followed by an epitaxial phase, making it        possible in particular to obtain thicker useful layers 40, for        example, from a few tens of nm to 20 μm.    -   Direct bonding and mechanical, chemical and/or chemical        mechanical thinning processes; they consist in assembling a        donor substrate by molecular bonding directly on the substrate        100 or 101 and then in thinning the donor substrate up to the        desired thickness of the useful layer 40, for example, by        grinding and by CMP (for “chemical mechanical polishing”). These        processes are particularly suitable for transferring thick        layers, for example, from a few microns to several tens of        microns, and up to a few hundred microns.

The aforementioned layer transfer processes are advantageously based ona molecular adhesive bonding phase of a donor substrate (from which theactive layer will be derived) and the support substrate 100, 101. In theparticular case where the second material 20 filling the trenches 2 is agas or a gaseous mixture, the atmosphere in the bonding enclosure willbe controlled (composition of the gas, pressure, etc.) so that the gastrapped in the trenches 2 after the assembly of the two substratescorresponds to the second material 20 expected. Specifically, theatmosphere in the bonding chamber may be brought to a very low pressurein order to achieve a quasi-vacuum configuration in the trenches 2, thistype of configuration being in some cases favorable to the mechanicalstrength of the superficial useful layer 40.

The useful layer 40 is made up of a material or stack of materialsmaking it possible to implement RF devices, analogous or digital. It maythus be chosen from among semiconductor, conductive or insulating,materials depending on the type of RF devices targeted; morespecifically, it may be made up of a material chosen from among thepiezoelectric materials.

The useful layer 40 may, for example, be made of silicon, germaniumsilicon, germanium, III-V material, lithium niobate, lithium tantalate,aluminum nitride, PZT and the like.

FIG. 6, Panels (a) through (c), illustrates substrates 102 according tothe disclosure, comprising:

-   -   A useful layer 40,    -   A dielectric layer 30,    -   A substrate 100 comprising a support substrate 10 made of a        first semiconductor material 10′ and:        -   Trenches 2 filled with a second material 20 (FIG. 6, Panel            (a));        -   Trenches 2, the walls of which are lined with a third            material 23, and which are filled with a second material 20            (FIG. 6, Panel (b));        -   Trenches 2, the walls of which are lined by a third material            23, and which are filled with a second material 20; an            additional layer 24 being sandwiched between the first side            of the support substrate 10 and the dielectric layer 30            (FIG. 6, Panel (c)).

As it is well known in the field of SOI substrates for radiofrequencyapplications, a dielectric layer, for example, formed by a silicon oxideon a silicon carrier substrate, has positive charges. These charges arecompensated for by negative charges coming from the support substrate atthe interface with the dielectric layer. These charges generate asurface parasitic conducting layer in the support substrate, beneath thedielectric layer: the resistivity of the support substrate at thisconducting layer then drops to around 10-100 ohms·cm. The electricalperformances that are sensitive to the resistivity of the supportsubstrate (such as the linearity of the signal, the level of insertionlosses, the quality factors of the passive components, etc.) aretherefore severely degraded by the presence of this conducting layer.

The role of the upper part 200 of substrate 102 is specifically to blockthe movement of the mobile charges generated in the vicinity of thefirst side of the support substrate 10 so that it retains a high andstable resistivity level.

Indeed, the restriction on the maximum dimension of the first zones 11makes it possible to block the movement of potential mobile charges inthe first semiconductor material 10′ constituting the support substrate10. The charges have to travel a greater distance to pass from one firstzone 11 to another first neighboring zone 11 by bypassing the trenches 2filled with the second material 20. The effective resistivity of theupper part 200 of substrate 102 is thus increased. This makes itpossible to eliminate all or part of the harmful effects of parasiticconduction which appears under the dielectric layer in a substrate 102comprising RF devices.

To illustrate, let us take the case of a substrate 102 as illustrated inFIG. 6, Panel (b), formed of a monocrystalline silicon support substrate10 with a nominal resistivity at 8 kohms·cm, of a depositedpolycrystalline silicon as the third material 23, of a deposited silicondioxide as the second material, the trenches 2 having a depth of 20microns; the dielectric layer 30 is also made of silicon dioxide and theuseful layer 40 is of monocrystalline silicon. FIG. 10 shows asimulation of the evolution of the effective resistivity of the upperpart 200 of the support substrate 10 as a function of the operatingfrequency of the radiofrequency devices present in and/or on the usefullayer 40. Variants A, B and C in FIG. 10 correspond to three differentmaximum dimensions of the first zones 11: 10 microns (A), 5 microns (B)and 2 microns (C). Variant A shows that the effective resistivity of theupper part 200 remains greater than 1,000 ohms·cm for frequencies belowabout 2.5 GHz. Variant B allows an effective resistivity of more than1,000 ohms·cm to be maintained for all frequencies below 5 GHz. Finally,variant C makes it possible to obtain an effective resistivity of theupper part 200 greater than the nominal resistivity of the supportsubstrate 10 for frequencies below 5 GHz; it also makes it possible toretain an effective resistivity of more than 1,000 ohms·cm for allfrequencies below 15 GHz. The confinement in the first zones 11 of themobile charges generated in the first semiconductor material 10′(silicon) under the dielectric layer 30 of silicon oxide thus makes itpossible to increase the effective resistivity of the upper part 200 ofthe support substrate 10: the dimensions of the first zones 11 arereduced as the effective resistivity increases and remains high over awide frequency range.

The permittivity of the upper part 200 is also improved in relation tothe permittivity of the initial support substrate 10 (silicon), due tothe presence of the second material (silicon dioxide) in the trenches 2.

The density of the first zone 11 and second zone 21 are chosen so as tomaintain an average thermal conductivity of the support substrate 10greater than 20 W/m·K, this is achieved by varying the dimensions (inthe X, Y plane) of the second zone 21.

Finally, the stability of the RF performances above 100° C. can beimproved in the upper part 200 of support substrate 10 because of thepresence of the third material 23 (polycrystalline silicon) on theinternal walls of the trenches 2, the third material 23 advantageouslyhaving the properties of trapping movable electrical charges since atleast a part of the thermal carriers generated in the firstsemiconductor material 10′ between the trenches 2 is going to be trappedat the level of the third material 23 over the entire depth of thetrenches 2, to provide the upper part 200 with a more stable effectiveresistivity over a wide range of temperatures.

Effective resistivity performances at room temperature, permittivity andsubstantially similar thermal conductivity are expected with a substrate102 as illustrated in FIG. 6, Panel (a), formed, for example, of asupport substrate 10 made of monocrystalline silicon with a nominalresistivity at 8 kohms·cm, of a gas or gas mixture as the secondmaterial 20 (air or nitrogen at atmospheric pressure or lower controlledpressure), the trenches 2 having a depth of 20 microns; the dielectriclayer 30 is also made of silicon dioxide and the useful layer 40 is madeof monocrystalline silicon.

According to another example, a substrate 102 based on FIG. 6, Panel(a), whose second material 20 (filling the trenches 2) is made of highlyresistive poly-silicon should have improved performances with respect tothe stability of effective resistivity over a wide range of temperaturesand the thermal conductivity of the upper part 200; the permittivity ofthe upper part 200 would, on the other hand, remain close to that of thesupport substrate 10 (silicon).

According to yet another example, let us take the case of a substrate102 as illustrated in FIG. 6, Panel (c), formed from a monocrystallinesilicon support substrate 10 with a nominal resistivity at 8 kohms·cm,of a deposited polycrystalline silicon as the third material 23, of asecond material of deposited silicon dioxide or silicon nitride, thetrenches 2 having a depth of 20 microns; the additional layer 24 is madeof poly-silicon, the dielectric layer 30 is also made of silicon dioxideand the useful layer 40 is of monocrystalline silicon.

The performances in terms of effective resistivity of the upper part 200over high frequency ranges (typically up to 50 GHz) are stillsignificantly improved compared to the previous examples: the effectiveresistivity reaches values up to 30 kohms·cm. In this example, thepresence of the additional layer 24 of third material 23 (poly-silicon)under the dielectric layer 30 makes it possible to effectively trap thefree carriers generated in the first zones 11. The confinement (in thefirst zones 11) of the residual mobiles charges present in the firstsemiconductor material 10′ makes it possible to further increase theeffective resistivity of the upper part 200 of support substrate 10.

The maximum size of the first zones 11 is advantageously chosendepending on the devices that will be produced on substrate 102 andspecifically depending on their size: for example, for an antennaswitch-type device comprising transistors characterized by a channellength less than 0.3 microns and a channel width greater than 500microns, the maximum dimension (in the X, Y planes in the figures) ofthe first zones 11 will be chosen from around 1 micron.

Generally, the maximum dimension of the first zones 11 and thedimensions of the second zone 21 are chosen so that each component“sees” substrate 102 as a substantially homogeneous substrate, i.e., thedevice should neither be laid out solely above a first zone 11 or solelyabove the second zone 21. It is beneficial that the component (in thiscase the transistor) has at least one dimension which extends over aplurality of first zones 11. This makes it possible in particular tolimit the inhomogeneous mechanical constraints at the level of thecomponents, capable of generating greater dispersion in the electricalfeatures of the components.

The depth of the trenches 2, and thus the thickness of the upper part200 of substrate 101, is also defined according to the type of RFdevices that will be produced on substrate 102 (or on substrate 100 or101). Specifically, this depth is chosen based on the power generated bythe devices and the depth of penetration of the electromagnetic field insubstrate 102. For example, for an antenna switch-type device switchinga power of 1 watt, penetration of the field being around 50 microns, thedepth of the trenches 2 will be selected to be of the order of 50microns, being typically between 30 and 70 microns.

It is beneficial that for RF devices operating at frequencies greaterthan 100 MHz, the second material 20 or the third material when it isused has properties for trapping movable electrical charges that can begenerated in the first semiconductor material 10′, as previously shownin some examples of substrates 102.

The disclosure also relates to a structure 110 of microelectronicradiofrequency devices (illustrated in FIG. 7) comprising:

-   -   A substrate 100 or 101 or 102 as previously described;    -   A layer of microelectronic devices 50 laid out directly on        substrate 100, 101 or on the dielectric layer 30, which itself        is laid out on substrate 100, 101.

According to an embodiment of the disclosure, the microelectronic device50 of the structure 110 may be an antenna switch or adaptor or a poweramplifier or a low-noise amplifier or a passive component (R, L, C).

As an illustration for the manufacture of this type of device, it willbe possible to use a substrate 102 having a useful layer 40 made ofsilicon with a thickness of between 10 nm and 1.5 microns, for example,145 nm, and an underlying dielectric layer 30 made of silicon oxidehaving a thickness of between 20 nm and 2 microns, for example, 400 nm;the first zones 11 have the shape of squares of 1 micron apart, spaced 2microns apart and the upper part 200 extends over 50 microns thick(depth of the trenches 2 filled by the second material 20). The firstsemiconductor material 10′ is monocrystalline silicon and the secondmaterial 20 is silicon nitride. Optionally, depending on the frequencyof use of the targeted components, a layer of carbon-enrichedpolycrystalline silicon, corresponding to the third material 23, mayline the walls of the trenches 2, sandwiched between the firstsemiconductor material 10′ and the second material 20; it may have athickness of a few dozens of nm to 200 nm. According to yet anotheroption, an additional layer 24 of polycrystalline silicon may besandwiched between the first side of the support substrate 10 and thedielectric layer 30; the additional layer 24 may have a thicknesstypically ranging from 100 nm to 1 micron.

The layer of microelectronic devices 50 developed in and on the usefullayer 40 comprises a plurality of active components (of the MOS type,bipolar type, etc.) and a plurality of passive components (ofcapacitors, inductors, resistors, etc.).

The fabrication of the microelectronic components requires theimplementation of several phases, including heat treatments at hightemperatures, typically at 950-1100° C., or even beyond. The upper part200 of structure 110, consisting of silicon (first semiconductormaterial 10′), silicon nitride (second material 20) and optionallycarbon-enriched poly-silicon (third material) is able to withstand thistype of treatment without undergoing any degradation likely to impactits RF properties.

According to a variant, the layer of microelectronic devices 50 can befirstly developed on a substrate of the SOI type and then transferred bya layer transfer technique known to those skilled in the art ontosubstrate 100 or 101 according to the disclosure, to form a structure111 illustrated in FIG. 8.

In FIG. 8, the structure 111 comprises, on the one hand, the supportsubstrate 10 comprising the plurality of trenches 2, filled with thesecond material 20, on which is optionally laid out a residual layer 22made of a second material 20 acting as a dielectric layer. Above thelatter, there is the layer of microelectronic devices 50: the so-called“back end” portion of layers of metallic interconnections anddielectrics is laid out above the residual layer 22, the so-called“front end” portion (silicon), developed partly in the useful layer 40,being itself above the back-end part. Finally, above the useful layer40, and optionally, there is a dielectric layer 31.

In both cases mentioned above, the electromagnetic fields resulting fromthe high-frequency signals intended to be spread in the microelectronicdevices 50 and which will penetrate into substrate 100, 101, 102 willsuffer only slight losses (insertion losses) and distortions(harmonics), due to the effective resistivity, greater than the nominalresistivity of the first semiconductor material 10′ of the supportsubstrate 10 or at least greater than 1,000 ohms·cm and stable over theentire operating temperature range (−40° C. to 150° C.), of the upperpart 200 of the structure 110, 111: in fact, the configuration of theupper part 200 according to the disclosure blocks the movement of themobile charges in the semiconductor substrate (coming from the parasiticconducting layer or thermal donors). Advantageously, the structure 110,111 will have favorable heat dissipating properties, the first materialbeing silicon. Also advantageously, the capacitive coupling between thelayer of microelectronic devices 50 and the support substrate 10 will begreatly reduced due to the average permittivity of the upper part 200,reduced compared to that of the silicon due to the presence of thetrenches filled with the second material (highly resistive orinsulating).

According to another embodiment of the disclosure, the microelectronicdevice 50 of the structure 110, 111 may consist of a radiofrequency MEMS(Micro Electro-Mechanical Systems) component, comprising, for example,at least one control element and a MEMS switching element consisting,for example, of a microswitch with ohmic contact or a capacitivemicroswitch.

One of the substrates 100, 101, 102 may be used as a support substratefor the MEMS component; the fabrication of the MEMS part is then basedon successive coatings of a plurality of layers (including an electrode,a dielectric, a sacrificial layer, an active layer) and by makingpatterns on these different layers.

The first zones 11 will, for example, be in the form of hexagons of 10microns apart, spaced 10 microns apart, and the upper part 200 willextend over 50 microns thick (depth of the trenches 2 filled by thesecond material 20). The first semiconductor material 10′ may bemonocrystalline silicon and the second material 20 made of the siliconnitride.

The microelectronic processes for manufacturing the control element(s)(CMOS, for example), usually carried out before the MEMS part, require,as in the previous embodiment, the application of heat treatments athigh temperatures.

According to a variant of the disclosure, which can be applied to allthe embodiments described, the mesh formed by the second zone 21 on thefirst side 1 of substrate 100 may be located in specific regions of thefirst side. It will thus be possible to have a plurality of second zones21 distributed over the first side 1 of substrate 100. In the areas ofthe first side 1 lacking these second zones 21, therefore, is found onlythe first semiconductor material 10′ of the support substrate 10. Thecontrol elements (CMOS) of the device, if they do not require anunderlying substrate with resistivity, restrictive permittivityproperties such as RF elements, may be developed in areas devoid ofsecond zones 21 (i.e., without trenches 2).

As mentioned above, the high-frequency signals propagating in thismicroelectronic device 50 generate electromagnetic fields (notably atthe level of the MEMS switching elements) which penetrate into thesupport substrate 10. The losses (insertion losses), distortions(harmonics) and disruptions will be less because of the high and stableeffective resistivity of the upper part 200 of the support substrate 10comprising trenches filled with the second material 20.

Advantageously, the structure 110, 111 will have favorable heatdissipating properties, the first material being silicon. Alsoadvantageously, the capacitive coupling between the layer ofmicroelectronic devices 50 and the support substrate 10 will be greatlyreduced due to the average permittivity of the upper part 200, reducedcompared to that of the silicon due to the presence of the trenchesfilled with the second material (highly resistive or insulating).

According to yet another embodiment of the disclosure, themicroelectronic device 50 of the structure 110, 111 may consist of aradiofrequency filter, operating by bulk acoustic wave propagation(called “BAW” for “Bulk Acoustic Wave”) or by acoustic propagation(known as “SAW” for “Surface Acoustic Wave”) or any other acousticpropagation mode.

The manufacture of a SAW filter requires, for example, a useful layer 40made of a piezoelectric material, on the surface of which an electrodecomb will be developed: the acoustic wave is intended to spread betweenthese electrodes. The structure 110 according to the disclosure may thuscomprise, as an illustration, a useful layer 40 of lithium tantalatewith a thickness of between 200 nm and 20 μm.

The first zones 11 may have a circular shape of 5 microns in diameter,spaced 5 microns apart and the upper part 200 may extend over 100microns in thickness (trench 2 depth). The first semiconductor material10′ is monocrystalline silicon and the second material 20 may be air oramorphous or polycrystalline silicon. A dielectric layer 30 mayoptionally be added between the useful layer 40 and the first side 1 ofthe support substrate 10.

The structure 110, in addition to being naturally more stable intemperature than a solid piezoelectric substrate, makes it possible toobtain better filter performance, notably in terms of insertion lossesand linearity.

The substrates 100, 101, 102 and the structures 110, 111 forradiofrequency applications according to the disclosure are not limitedto the embodiments mentioned above. They are suitable for anyapplication for which high frequency signals spread and are liable tosuffer undesired losses or disturbances in a support substrate: indeed,the physical and electrical features of the upper part 200 of thesubstrate confer on the assembly good RF properties (limiting losses,non-linearities and other disturbances), stable over the entireoperating temperature range. They also confer good thermal conductivityproperties and a relative permittivity of less than 11 allowing a weakcapacitive coupling between the active layer and the support substrate10. By choosing the dimensions of the first zone 11 and second zone 21and the nature of the first semiconductor material 10′, second material20 and potentially 3rd materials, it is possible to give priority tocertain performances (effective resistivity, stability in temperature,thermal conductivity, permittivity) over others; depending on theapplications, compromises can thus be found, on the one hand, to meetthe specifications of the microelectronic devices to be developed, butalso to meet the manufacturing cost of substrate 100, 101, 102 thusenabling its mass adoption.

The substrates 100, 101, 102 and the structures 110, 111 according tothe disclosure may specifically be of interest for devices combining RFfunctions with high-performance digital or analogue functions (i.e.,with high operating frequencies f_(T), f_(max)).

In some cases, the digital and/or analogue functions do not require aresistive substrate that has the properties according to the disclosure:the upper part 200 of the substrate according to the disclosure,comprising the trenches filled with the second material 20, can then belocal and not present on the entire substrate 100, 101, 102. There isthus a plurality of second zones 21 on the first side 1 of thesubstrate, located in different regions of the first side. In the areasof the first side 1 lacking these second zones 21, therefore, is foundonly the first semiconductor material 10′ of the support substrate 10.The digital and/or analogue functions of the device, if they do notrequire an underlying substrate with resistivity, restrictivepermittivity properties such as RF components, may be developed in areaslacking second zones 21 (i.e., without trenches 2).

Of course, the disclosure is not limited to the embodiments and examplesdescribed, and variants can be provided without departing from the scopeof the invention as defined by the claims.

What is claimed is:
 1. A substrate for microelectronic radiofrequencydevices comprising: a support substrate comprising a first semiconductormaterial having a resistivity greater than 500 ohms·cm; a plurality oftrenches in the support substrate filled with a second material anddefining a plurality of first zones on a first side of the firstsemiconductor material and at least one second zone of a secondmaterial, the second material having a resistivity greater than 10kohms·cm, the plurality of first zones having a maximum lateraldimension of less than 10 microns, the plurality of first zones beingisolated from one another by the at least one second zone; and a usefullayer comprising a material selected from a group consisting of asemiconductor material, an insulating material, a conductive material,or a piezoelectric material located on or above the upper surface of thesupport substrate.
 2. The substrate of claim 1, wherein the secondmaterial comprises an oxide or a nitride material.
 3. The substrate ofclaim 1, wherein the second material comprises silicon oxide, siliconnitride, silicon oxynitride, or aluminum nitride.
 4. The substrate ofclaim 1 wherein the second material comprises an amorphous siliconmaterial or a polycrystalline silicon material.
 5. The substrate ofclaim 1, wherein the at least one second zone forms a mesh on the firstside of the support substrate.
 6. The substrate of claim 1, wherein thedepth of the plurality of trenches is between 1 micron and 100 microns.7. The substrate of claim 1, wherein the useful layer comprises apiezoelectric material.
 8. The substrate of claim 1, further comprisinga dielectric layer on the first side of the support substrate, whereinthe dielectric layer is sandwiched between the useful layer and thefirst side of the support substrate.
 9. The substrate of claim 8,wherein the dielectric layer comprises a material selected from thegroup consisting of silicon oxide, silicon nitride, silicon oxynitride,or aluminum nitride.
 10. A substrate for microelectronic radiofrequencydevices, comprising: a substrate comprising a semiconductor material;trenches in an upper surface of the substrate, at least some of thetrenches comprising a first filler material located within therespective trench and a maximum lateral dimension of the trenches is 10microns or less; and a dielectric layer located on the upper surface ofthe substrate, wherein the dielectric layer comprises an oxide or anitride material.
 11. The substrate of claim 10, wherein an averagethermal conductivity of a region of the substrate extending from theupper surface to a depth of the trenches is 20 W/m K or greater.
 12. Thesubstrate of claim 10, wherein a first resistivity of the semiconductormaterial of the substrate is 500 ohms cm or greater and a secondresistivity of the first filler material in the trenches is 10 kohms·cmor greater.
 13. The substrate of claim 10, wherein at least some of thetrenches comprise the first filler material occupying a portion of arespective trench and a second filler material occupying a remainder ofthe respective trench.
 14. The substrate of claim 13, wherein the secondfiller material has a composition different than the first fillermaterial.
 15. The substrate of claim 14, wherein the second fillermaterial is selected from the group consisting of silicon oxide, siliconnitride, silicon oxynitride, aluminum nitride, amorphous orpolycrystalline silicon, carbon-rich silicon, a polymer, or a gas. 16.The substrate of claim 10, further comprising a useful layer comprisinga material selected from a group consisting of a semiconductor material,an insulating material, a conductive material, or a piezoelectricmaterial located on or above the upper surface of the dielectricmaterial.
 17. The substrate of claim 16, wherein the useful layercomprises a piezoelectric material.
 18. A method of making a substratefor microelectronic radiofrequency devices, comprising: forming trenchesin an upper surface of a substrate comprising a semiconductor material;placing a filler material in at least some of the trenches, wherein anaverage thermal conductivity of a region of the substrate extending fromthe upper surface to a depth of the trenches is 20 W/m·K or greater; andplacing a dielectric layer located on the upper surface of thesubstrate, wherein the dielectric layer comprises an oxide or a nitridematerial.
 19. The method of claim 18, further comprising placing auseful layer comprising a material selected from a group consisting of asemiconductor material, an insulating material, a conductive material,or a piezoelectric material located on or above the dielectric layer.20. The method of claim 19, wherein placing the useful layer comprisesplacing a layer of piezoelectric material on or above the surface of thedielectric layer.